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IEC's activities, collectively known as electrotechnology, cover all electrical, electronic and associated technologies in the areas of power generation, transmission and distribution, medical equipment, semiconductors, fibre optics, nanotechnology and renewable energies. In addition to providing an excellent framework for improving safety and optimizing energy, IEC standards support trade between countries by providing a reference for the functioning of the World Trade Organization (WTO) Agreement on Technical Barriers to Trade.
Electromagnetic Compatibility (EMC) - Part 4-12: Testing and measurement techniques - Ring wave immunity test
$164.00 $329.00
Amendment 2 - Household and similar electrical appliances - Safety - Part 2-85: Particular requirements for fabric steamers
$6.00 $13.00
Digital living network alliance (DLNA) home networked device interoperability guidelines - Part 7: Authentication
$72.00 $145.00
Cable networks for television signals, sound signals and interactive services - Part 13-1: Bandwidth expansion for broadcast signal over FTTH system
$208.00 $417.00
Digital living network alliance (DLNA) home networked device interoperability guidelines - Part 4: DRM interoperability solutions
$117.00 $234.00
Industrial communication networks - Wireless communication networks - Part 2: Coexistence management
Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension
$95.00 $190.00
Amendment 1 - Framework for energy market communications - Part 451-3: Transmission capacity allocation business process (explicit or implicit auction) and contextual models for European market
$47.00 $95.00
Corrigendum 1 - Small bore connectors for liquids and gases in healthcare application - Part 5: Connectors for limb cuff inflation applications
$110.00 $220.28
EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
$227.00 $455.00
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
Connectors for electronic equipment - Part 02: Detail specification for 8-way, unshielded, free and fixed high density connectors for data transmission up to 250 MHz and with current carrying capacity up to 1 A