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IEC's activities, collectively known as electrotechnology, cover all electrical, electronic and associated technologies in the areas of power generation, transmission and distribution, medical equipment, semiconductors, fibre optics, nanotechnology and renewable energies. In addition to providing an excellent framework for improving safety and optimizing energy, IEC standards support trade between countries by providing a reference for the functioning of the World Trade Organization (WTO) Agreement on Technical Barriers to Trade.
Amendment 1 - Household and similar electrical appliances - Safety - Part 2-96: Particular requirements for flexible sheet heating elements for room heating
$23.00 $47.00
Insulated bushings for alternating voltages above 1000 V
$89.00 $179.00
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
$129.00 $259.92
Amendment 1 - Standard data element types with associated classification scheme for electric components - Part 1: Definitions - Principles and methods
$30.00 $61.00
Amendment 2 - Insulating and sheathing materials of electric and optical cables - Common test methods - Part 3-2: Methods specific to PVC compounds - Loss of mass test - Thermal stability test
$12.00 $24.00
Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance CONSOLIDATED EDITION
$61.00 $122.00
Fibre-optic communication subsystem test procedures - Part 4-1: Cable plant and links - Multimode fibre-optic cable plant attenuation measurement
$48.00 $97.00
Fibre optic active components and devices - Package and interface standards - Part 6: ATM-PON transceivers
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
$183.00 $367.00
Power consumption of information technology equipment - Measurement methods
$12.00 $25.00
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
$47.00 $95.00
Digital audio - Interface for non-linear PCM encoded audio bitstreams applying IEC 60958 - Part 4: Non-linear PCM bitstreams according to the MPEG audio format
