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IPC serves more than 2,300 member companies worldwide involved in designing, manufacturing, specifying and/or using printed circuit boards. Approximately 200 standards, guidelines and technical reports cover topics ranging from design and printed circuit board manufacturing to electronics assembly and testing.
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, with Amendment 1
$23.00 $46.00
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
$71.00 $142.00
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
$50.00 $101.00
Generic Requirements for Electronic Manufacturing Supply Chain Communication - Product Data eXchange (PDX)
$61.00 $123.00
Printed Board Dimensions and Tolerances
Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
$67.00 $135.00
Sectional Requirements for Implementation of Bare-Board Product Testing Data Description
$43.00 $86.00
Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology
$80.00 $160.00
IPC 6th Annual National Conference on Flexible Circuits: A Technology Comes of Age
$57.00 $114.00
Analysis of the Market for Rigid Printed Wiring Boards and Related Materials for 1999
$283.00 $567.00
Generic Standard on Printed Board Design, Includes Amendment 1
$41.00 $83.00
Sectional Requirements for Implementation of Assembly In-Circuit Test Data Description
