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JEDEC is the global leader in developing open standards for the microelectronics industry. With over 4,000 volunteers representing nearly 300 member companies. JEDEC brings manufacturers and suppliers together on 50 different committees, creating standards to meet the diverse technical and developmental needs of the industry. These collaborations ensure product interoperability, benefiting the industry and ultimately consumers by decreasing time-to-market and reducing product development costs.
PRODUCT DISCONTINUANCE
$25.00 $51.00
DEFINITION OF THE SSTUA32S868 AND SSTUA32D868 REGISTERED BUFFER WITH PARITY FOR 2R X 4 DDR2 RDIMM APPLICATIONS
$37.00 $74.00
DEFINITION OF THE SSTVN16859 2.5-2.6 V 13-BIT TO 26-BIT SSTL_2 REGISTERED BUFFER FOR PC1600, PC2100, PC2700 AND PC3200 DDR DIMM APPLICATIONS
$29.00 $59.00
PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD)
$30.00 $60.00
GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
$31.00 $62.00
HYBRIDS/MCM
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SURFACE-MOUNT COMPONENTS
IPC/JEDEC-9704: Printed Wiring Board (PWB) Strain Gage Test Guideline
STANDARD FOR DEFINITION OF CU877 PLL CLOCK DRIVER FOR REGISTERED DDR2 DIMM APPLICATIONS
A PROCEDURE FOR MEASURING P-CHANNEL MOSFET NEGATIVE BIAS TEMPERATURE INSTABILITIES
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
THERMAL SHOCK
