Your shopping cart is empty!
JEDEC is the global leader in developing open standards for the microelectronics industry. With over 4,000 volunteers representing nearly 300 member companies. JEDEC brings manufacturers and suppliers together on 50 different committees, creating standards to meet the diverse technical and developmental needs of the industry. These collaborations ensure product interoperability, benefiting the industry and ultimately consumers by decreasing time-to-market and reducing product development costs.
DDR5 SODIMM Raw Card Annex E
$130.00 $261.53
DEFINITION OF the SSTUB32866 1.8 V CONFIGURABLE REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
$113.00 $228.00
Wire Bond Pull Test Methods
$121.00 $243.60
DDR5 SODIMM Raw Card Annex B. Version 1.0
$124.00 $248.11
Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Electronic Devices
$30.00 $60.00
THERMAL SHOCK
$112.00 $225.35
System Level ESD Part III: Review of ESD Testing and Impact on System-Efficient ESD Design (SEED)
$126.00 $253.01
Temperature Range and Measurement Standards for Components and Module
$31.00 $62.00
JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS
$119.00 $238.01
REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES
$137.00 $274.40
DDR5 SODIMM Raw Card Annex C. Version 1.0
$106.00 $212.66
LRDIMM DDR3 MEMORY BUFFER (MB) Version 1.0
$140.00 $281.83
