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ASTM International, 06/01/2007
Publisher: ASTM
File Format: PDF
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Published:01/06/2007
Pages:2
File Size:1 file , 60 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
1.1 This guide covers sputtering targets used as thin film source material in fabricating semiconductor electronic devices. It should be used to develop target specifications for specific materials and should be referenced therein.
1.2 This standard sets purity grade levels, analytical methods and impurity content reporting method and format.
1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.
Standard Tables of Body Measurements for Big Girls Regular Figure Type, Size Range 7 – 20
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Standard Test Method for Measurement of Heat of Hydration of Hydraulic Cementitious Materials Using Isothermal Conduction Calorimetry
Standard Specification for Crosslinked Polyethylene Insulation for Wire and Cable Rated 0 to 2000 V, 90 °C Operation
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Standard Guide for Using Micro X-Ray Fluorescence (μ-XRF) in Forensic Polymer Examinations
