Your shopping cart is empty!
ASTM International, 06/10/2001
Publisher: ASTM
File Format: PDF
$25.00$50.00
Published:10/06/2001
Pages:2
File Size:1 file , 38 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
1.1 This guide covers sputtering targets used as thin film source material in fabricating semiconductor electronic devices. It should be used to develop target specifications for specific materials and should be referenced therein.
1.2 This standard sets purity grade levels, analytical methods and impurity content reporting method and format.
1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.
Standard Test Method for Counting Partial Cleavages in Wool and Other Animal Fibers
$25.00 $50.00
Standard Test Method for Tumbling Friability of Preformed Block-Type and Preformed Pipe-Covering-Type Thermal Insulation
$26.00 $52.00
Standard Practice for Pulse Counting System Dead Time Determination by Measuring Isotopic Ratios with SIMS
Standard Practice for Quality Management Systems for Nondestructive Testing Agencies
$29.00 $58.00
