Your shopping cart is empty!
ASTM International, 06/01/2015
Publisher: ASTM
File Format: PDF
$21.00$42.00
Published:01/06/2015
Pages:3
File Size:1 file , 130 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility
1.2 A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).
Standard Specification for Adhesive for Bonding Foam Cored Sandwich Panels (160 degrees ;F Elevated Humidity Service), Type I Panels
$25.00 $50.00
Standard Terminology for Scientific Charge-Coupled Device (CCD) Detectors
$29.00 $58.00
Standard Test Method for Freeze/Thaw Resistance of Exterior Insulation and Finish Systems (EIFS) and Water Resistive Barrier Coatings
Standard Test Method for Impact Resistance of Class PB and PI Exterior Insulation and Finish Systems (EIFS)
