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ASTM International, 06/01/2015
Publisher: ASTM
File Format: PDF
$21.00$42.00
Published:01/06/2015
Pages:3
File Size:1 file , 130 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility
1.2 A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).
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