Your shopping cart is empty!
ASTM International, 05/01/2016
Publisher: ASTM
File Format: PDF
$24.00$48.00
Published:01/05/2016
Pages:5
File Size:1 file , 110 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
1.1 This specification details the generic criteria requirements of high pure titanium sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advance packaging.
1.2 Sputtering target purity, grain size, inner quality, bonding, dimension, and appearance specifications are included in this specification along with references for qualification test methods. Reliability, certification, traceability, and packaging requirements are also included.
1.2.1 Purity Requirements:
1.2.1.1 Metallic element impurities, and
1.2.1.2 Non-metallic element impurities.
1.2.2 Grain Size Requirements-Grain size.
1.2.3 Inner Quality Requirements-Internal defect.
1.2.4 Bonding Requirements:
1.2.4.1 Backing plate, and
1.2.4.2 Bonding ratio.
1.2.5 Configuration Requirements:
1.2.5.1 Dimension,
1.2.5.2 Tolerance, and
1.2.5.3 Surface roughness.
1.2.6 Appearance Requirements-Surface cleanness.
1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Standard Specification for Zinc-Coated (Galvanized) Steel Welded Wire Reinforcement, Plain and Deformed, for Concrete
$25.00 $50.00
Standard Guide for The Identification of Metals and Alloys in Computerized Material Property Databases
$32.00 $65.00
Standard Specification for Zirconium and Zirconium Alloy Strip, Sheet, and Plate
$30.00 $60.00
Standard Test Method for Bead Unseating of Tubeless Tires for Motor Vehicles with GVWR of 4536 kg (10 000 lb) or Less
$29.00 $58.00
