BS 05/30132033 DC

IEC 60191-6-13. Mechanical standardization of semiconductor devices. Part 6-13. Design guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

BSI Group, 04/27/2005

Publisher: BS

File Format: PDF

$126.00$252.66

Description

Published:27/04/2005

Pages:15

Cross References:
IEC 60191-1:1966
IEC 60191-2:1966
IEC 60191-3:1999
IEC 60191-4:1999
IEC 60191-6:1990

All current amendments available at time of purchase are included with the purchase of this document.

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