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BSI Group, 07/13/2006
Publisher: BS
File Format: PDF
$130.00$261.95
Published:13/07/2006
Pages:14
BS EN 60191-6-19. Mechanical standardization of semiconductor devices. Part 6-19. Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
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BS EN 60424-5. Ferrite cores. Guide on the limits of surface irregularities. Part 5. Planar-cores
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BS ISO/IEC 24766. Information technology. Guideline to requirement engineering tool capabilities
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BS ISO/IEC 11695-2. Identification cards. Optical memory cards. Holographic recording method. Part 2. Dimensions and location of accessible optical area
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