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BS EN 60191-6-17. Mechanical standardization of semiconductor devices. Part 6-17. Design guide for stacked packages and individual stackable packages. Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA)

BSI Group, 06/19/2007

Publisher: BS

File Format: PDF

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Description

Published:19/06/2007

Pages:26

Cross References: IEC 60191-6:1990*IEC 60191-6-5*

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