BS 08/30175763 DC

BS EN 60191-6-18. Mechanical standardization of semiconductor devices. Part 6-18. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

BSI Group, 01/03/2008

Publisher: BS

File Format: PDF

$101.00$203.23

Published:03/01/2008

Pages:18

Cross References:
IEC 60191-6:2004

All current amendments available at time of purchase are included with the purchase of this document.

Industrial automation systems and integration. Product data representation and exchange-Description methods: SysML XMI to XSD transformation

$189.00 $378.46

Industrial automation systems and integration. Product data representation and exchange-Description methods: SysML XMI to EXPRESS transformation

$147.00 $294.64

Ergonomics of human-system interaction-Guidance on the presentation of auditory information

$125.00 $251.46

Space engineering. Software engineering handbook

$226.00 $452.12