BS 08/30175763 DC

BS EN 60191-6-18. Mechanical standardization of semiconductor devices. Part 6-18. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

BSI Group, 01/03/2008

Publisher: BS

File Format: PDF

$101.00$203.23

Published:03/01/2008

Pages:18

Cross References:
IEC 60191-6:2004

All current amendments available at time of purchase are included with the purchase of this document.

Methods of test for adhesives. Adhesively bonded joints: mechanical tests-Determination of bond strength in direct tension in sandwich panels

$73.00 $147.32

Manhole steps-Specification for plastics encapsulated manhole steps

$90.00 $180.34

Glossary of building and civil engineering terms. General and miscellaneous-Environment and physical planning

$36.00 $73.66

Specification for safety of household and similar electrical appliances. Particular requirements-Commercial electric ranges, ovens and hob elements

$90.00 $180.34