BS 08/30190030 DC

BS EN 60191-6-21. Mechanical standardization of semiconductor devices. Part 6-21. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

BSI Group, 12/01/2008

Publisher: BS

File Format: PDF

$125.00$250.64

Description

Published:01/12/2008

Pages:17

Cross References:
IEC 60191-4
IEC 60191-6

All current amendments available at time of purchase are included with the purchase of this document.

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