BS 08/30190030 DC

BS EN 60191-6-21. Mechanical standardization of semiconductor devices. Part 6-21. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

BSI Group, 12/01/2008

Publisher: BS

File Format: PDF

$125.00$250.64

Description

Published:01/12/2008

Pages:17

Cross References:
IEC 60191-4
IEC 60191-6

All current amendments available at time of purchase are included with the purchase of this document.

More BS standard pdf

BS +AU 169:1978

Method for determination of burning behaviour of interior materials for motor vehicles

$125.00 $251.46

BS 2690-100:1978

Methods of testing water used in industry-Foreword, scope and general requirements

$76.00 $152.40

Specification for bars and extruded sections of aluminium-copper-magnesium-silicon-manganese alloy (solution treated and artificially aged) (not exceeding 200 mm diameter or minor sectional dimension) (Cu 4.4, Mg 0.5, Si 0.7, Mn 0.8)