BS 09/30211762 DC

BS EN 60191-6-5. Mechanical standardization of semiconductor devices. Part 6-5. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch ball grid array (FBGA)

BSI Group, 10/26/2009

Publisher: BS

File Format: PDF

$143.00$287.32

Published:26/10/2009

Pages:22

Cross References:
IEC 60191-6

All current amendments available at time of purchase are included with the purchase of this document.

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