BS 10/30211454 DC

BS EN 62047-13. Semiconductor devices. Micro-electromechanical devices. Part 13. Bend- and shear- test methods of measuring adhesive strength for MEMS structures

BSI Group, 02/22/2010

Publisher: BS

File Format: PDF

$124.00$248.30

Description

Published:22/02/2010

Pages:13

Cross References:
IEC 62047-2

All current amendments available at time of purchase are included with the purchase of this document.

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