BS 11/30248240 DC

BS EN 60191-6-22. Mechanical standardization of semiconductor devices. Part 6-22. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages. Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array

BSI Group, 06/02/2011

Publisher: BS

File Format: PDF

$116.00$233.80

Published:02/06/2011

Pages:20

Cross References:
IEC 60191-6

All current amendments available at time of purchase are included with the purchase of this document.

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