BS 12/30274804 DC

BS IEC 61189-5-4. Test methods for electrical materials, interconnection structures and assemblies. Part 5-4. Test methods for printed board assemblies. Solder alloys and fluxed and non-fluxed solid wire

BSI Group, 11/12/2012

Publisher: BS

File Format: PDF

$131.00$262.13

Description

Published:12/11/2012

Pages:17

Cross References:
IEC 60068-1:1988
IEC 60068-2-20
IEC 61189-1
IEC 61189-3
IEC 61189-6
IEC 61190-1-1
IEC 61190-1-2
IEC 61190-1-3
IEC 61249-2-7
IEC 62137:2004
ISO 5725-2
ISO 9001
ISO 9455-1
ISO 9455-2
IPC-9201:1996
IPC-TR-467:1996
ASTM B-36

All current amendments available at time of purchase are included with the purchase of this document.

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