BS 4584-103.1:1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board

BSI Group, 02/28/1990

Publisher: BS

File Format: PDF

$44.00$88.90

Description

Published:28/02/1990

Pages:12

File Size:1 file , 830 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Two types of epoxide resin impregnated woven glass fabric with the resin cured to B stage.

Cross References:
BS 4584:Part 1

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