BS DD IEC/PAS 62137-3:2008

Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

BSI Group, 01/31/2009

Publisher: BS

File Format: PDF

$166.00$332.74

Description

Published:31/01/2009

Pages:46

File Size:1 file , 880 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Cross References:
IEC 60068-1:1988
IEC 60068-1:1988/AMD 1:1988
IEC 60068-2-2:2007
IEC 60068-2-14:1984
IEC 60068-2-14:1984/AMD 1:1986
IEC 60068-2-78:2001
IEC 60194:2006
IEC 61188-5
IEC 61190-1-1:2002
IEC 61190-1-2:2007
IEC 61249-2-7:2002
IEC 62137:2005
IEC 62137-1-1:2007
IEC 62137-1-2:2007
IEC 62137-1-3
IEC 62137-1-4
IEC 62137-1-5

All current amendments available at time of purchase are included with the purchase of this document.

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