BS PD IEC TR 61760-3-1:2022

Surface mounting technology-Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

BSI Group, 10/31/2022

Publisher: BS

File Format: PDF

$125.00$251.46

Published:31/10/2022

Pages:30

File Size:1 file , 2.4 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

All current amendments available at time of purchase are included with the purchase of this document.

Specification for copper-beryllium alloy strip, foil and parts (solution treated (W) and precipitated)

$76.00 $152.40

Procedure for inspection and testing of textiles for aerospace purposes

$125.00 $251.46

Specification for E glass fibre woven roving fabrics for the reinforcement of polyester and epoxy resins systems

$76.00 $152.40

Analysis of nickel alloys by flame atomic absorption spectrometry-Method for the determination of iron

$76.00 $152.40