BS PD IEC TR 62878-2-7:2019

Device embedding assembly technology-Guidelines. Accelerated stress testing of passive embedded circuit boards

BSI Group, 04/01/2019

Publisher: BS

File Format: PDF

$90.00$180.34

Description

Published:01/04/2019

Pages:14

File Size:1 file , 2.5 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

BS PD IEC TR 62878-2-7:2019 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

Cross References:
IEC 60194

All current amendments available at time of purchase are included with the purchase of this document.

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