BS PD IEC TR 62878-2-7:2019

Device embedding assembly technology-Guidelines. Accelerated stress testing of passive embedded circuit boards

BSI Group, 04/01/2019

Publisher: BS

File Format: PDF

$90.00$180.34

Description

Published:01/04/2019

Pages:14

File Size:1 file , 2.5 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

BS PD IEC TR 62878-2-7:2019 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

Cross References:
IEC 60194

All current amendments available at time of purchase are included with the purchase of this document.

More BS standard pdf

BS 11/30241968 DC

BS 5896. High tensile steel wire and strand for the prestressing of concrete. Specification

$125.00 $251.54

BS 11/30175582 DC

BS EN 60050-395. International electrotechnical Vocabulary. Part 395. Nuclear instrumentation. Physical phenomena, basic concepts, instruments, systems, equipment and detectors

$127.00 $255.13

BS 11/30197617 DC

BS ISO 11855-5. Building environment design. Standards for the design, construction and operation of radiant heating and cooling systems. Part 5. Installation

$141.00 $282.49

BS 11/30242257 DC

BS EN ISO 9712. Non-destructive testing. Qualification and certification of NDT personnel. General principles

$121.00 $243.66