BS PD IEC TR 63378-1:2021

Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

BSI Group, 01/11/2022

Publisher: BS

File Format: PDF

$125.00$251.46

Description

Published:11/01/2022

Pages:24

File Size:1 file , 2.4 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

All current amendments available at time of purchase are included with the purchase of this document.

More BS standard pdf

BS DD 78:1981

Specification for higher purity copper cathode

$166.00 $332.74

BS 9763:1977

Specification for printed circuits of assessed quality: sectional specification for single- and double-sided printed circuits without plated through holes

$125.00 $251.46

BS 3772:1981

Specification for starters for fluorescent lamps

$90.00 $180.34

BS 6161-4:1981

Methods of test for anodic oxidation coatings on aluminium and its alloys-Assessment of sealing quality by measurement of the loss of mass after immersion in acid solution

$34.00 $68.58