BS PD IEC TR 63378-1:2021

Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

BSI Group, 01/11/2022

Publisher: BS

File Format: PDF

$125.00$251.46

Description

Published:11/01/2022

Pages:24

File Size:1 file , 2.4 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

All current amendments available at time of purchase are included with the purchase of this document.

More BS standard pdf

BS 3227:2003

Butyl rubber compounds (including halobutyl compounds). Specification

$76.00 $152.40

BS 2752:2003

Chloroprene rubber compounds. Specification

$76.00 $152.40

BS PD CLC/TR 50403:2002

Standardization and the liberalization of the energy market

$90.00 $180.34

BS 7870-7.2:2003

LV and MV polymeric insulated cables for use by distribution and generation utilities. Specification for power cables having rated voltages of 3.8/6.6 kV and 6.35/11 kV with special fire performance for use in power stations-Single-core and 3-core cables with halogen-free materials and with aluminium or steel wire armouring

$88.00 $177.80