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BSI Group, 01/11/2022
Publisher: BS
File Format: PDF
$125.00$251.46
Published:11/01/2022
Pages:24
File Size:1 file , 2.4 MB
Note:This product is unavailable in Ukraine, Russia, Belarus
This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.All current amendments available at time of purchase are included with the purchase of this document.
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