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BSI Group, 01/11/2022
Publisher: BS
File Format: PDF
$125.00$251.46
Published:11/01/2022
Pages:24
File Size:1 file , 2.4 MB
Note:This product is unavailable in Ukraine, Russia, Belarus
This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.All current amendments available at time of purchase are included with the purchase of this document.
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: aluminium electrolytic capacitors with solid electrolyte
$71.00 $142.24
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: fixed polyester film dielectric d.c. capacitors
$125.00 $251.46
Detail specification for radio frequency coaxial connectors (series SMA). 50 ohms, unsealed, soldered, centre contact, clamp outer for flexible cables, solder outer for semi-rigid cables-Control drawings. Mating face details and gauge information
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: fixed metallized polycarbonate film dielectric d.c. capacitors
