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BSI Group, 02/28/2014
Publisher: BS
File Format: PDF
$166.00$332.74
Published:28/02/2014
Pages:50
File Size:1 file , 1.7 MB
Note:This product is unavailable in Ukraine, Russia, Belarus
Data requirements for semiconductor die-Mechanical, material and connectivity requirements
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PNO-ISC specification number 005 C7. Interconnect message transfer part (MTP)