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International Electrotechnical Commission, 07/01/1983
Publisher: IEC
File Format: PDF
$6.00$12.00
Published:01/07/1983
Pages:3
File Size:1 file , 77 KB
Note:This product is unavailable in Ukraine, Russia, Belarus
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
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Amendment 1 - Shunt power capacitors of the non-self-healing type for a.c. systems having a rated voltage up to and including 1000 V - Part 1: General - Performance, testing and rating - Safety requirements - Guide for installation and operation
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Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-1: Examinations and measurements - Visual examination
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