IEC 60068-2-54 Ed. 2.0 en:2006

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

International Electrotechnical Commission, 04/27/2006

Publisher: IEC

File Format: PDF

$69.00$139.00

Description

Published:27/04/2006

Pages:18

File Size:1 file , 350 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

More IEC standard pdf

IEC 61391-2 Ed. 1.0 b:2010

Ultrasonics - Pulse-echo scanners - Part 2: Measurement of maximum depth of penetration and local dynamic range

$139.00 $278.00

IEC 60335-2-49 Amd.1 Ed. 4.0 b:2008

Amendment 1 - Household and similar electrical appliances - Safety - Part 2-49: Particular requirements for commercial electric appliances for keeping food and crockery warm

$25.00 $51.00

IEC 61196-1-110 Ed. 1.0 en:2016

Coaxial communication cables - Part 1-110: Electrical test methods - Test for continuity

$12.00 $25.00

IEC 62128-1 Ed. 2.0 b:2013

Railway applications - Fixed installations - Electrical safety, earthing and the return circuit - Part 1: Protective provisions against electric shock

$227.00 $455.00