IEC 60191-4 Ed. 2.2 b:2002

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION

International Electrotechnical Commission, 10/22/2002

Publisher: IEC

File Format: PDF

$91.00$182.00

Description

Published:22/10/2002

Pages:43

File Size:1 file , 610 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.

More IEC standard pdf

IEC 61753-021-02 Ed. 1.0 b:2023

Fibre optic interconnecting devices and passive components – Performance standard – Part 021-02: Single-mode fibre optic connectors terminated as pigtails and patchcords for category C – Controlled environment

$72.00 $145.00

IEC /SRD 63456 Ed. 1.0 en:2023

Navigation tools for smart manufacturing

$139.00 $278.00

IEC 61511-SER Ed. 1.0 b:2021

Functional safety - Safety instrumented systems for the process industry sector - ALL PARTS

$911.00 $1,823.00

IEC 60664-SER Ed. 1.0 b:2021

Insulation coordination for equipment within low-voltage systems - ALL PARTS

$677.00 $1,355.00