IEC 60191-5 Ed. 2.0 b:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

International Electrotechnical Commission, 04/23/1997

Publisher: IEC

File Format: PDF

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Description

Published:23/04/1997

Pages:71

File Size:1 file , 570 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

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IEC 60191-5 Ed. 2.0 b:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

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