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IEC 60191-6-1 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

International Electrotechnical Commission, 10/30/2001

Publisher: IEC

File Format: PDF

$12.00$25.00


Published:30/10/2001

Pages:7

File Size:1 file , 230 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

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