• Your shopping cart is empty!

PDF Preview

IEC 60191-6-1 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

International Electrotechnical Commission, 10/30/2001

Publisher: IEC

File Format: PDF

$12.00$25.00


Published:30/10/2001

Pages:7

File Size:1 file , 230 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

More IEC standard pdf

IEC 61915-2 Ed. 1.0 b COR.1:2012

IEC 61915-2 Ed. 1.0 b COR.1:2012

Corrigendum 1 - Low-voltage switchgear and controlgear - Device profiles for networked industrial devices - Part 2: Root device profiles for starters and similar equipment

$132.00 $265.76

IEC 61788-13 Ed. 1.0 b:2003

IEC 61788-13 Ed. 1.0 b:2003

Superconductivity - Part 13: AC loss measurements - Magnetometer methods for hysteresis loss in Cu/Nb-Ti multifilamentary composites

$39.00 $79.00

IEC 61249-2-12 Ed. 1.0 b:1999

IEC 61249-2-12 Ed. 1.0 b:1999

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

$47.00 $95.00

IEC 61219 Ed. 1.0 b:1993

IEC 61219 Ed. 1.0 b:1993

Live working - Earthing or earthing and short-circuiting equipment using lances as a short-circuiting device - Lance earthing

$139.00 $278.00