IEC 60191-6-10 Ed. 1.0 en:2003

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

International Electrotechnical Commission, 11/19/2003

Publisher: IEC

File Format: PDF

$37.00$74.00

Description

Published:19/11/2003

Pages:12

File Size:1 file , 610 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (P-VSON).

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