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IEC 60191-6-12 Ed. 1.0 en:2002

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

International Electrotechnical Commission, 06/14/2002

Publisher: IEC

File Format: PDF

$50.00$100.00


Published:14/06/2002

Pages:20

File Size:1 file , 490 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

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