IEC 60191-6-13 Ed. 1.0 b:2007

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

International Electrotechnical Commission, 06/27/2007

Publisher: IEC

File Format: PDF

$36.00$73.00

Description

Published:27/06/2007

Pages:29

File Size:1 file , 1000 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-13:2007 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.

More IEC standard pdf

IEC 60904-5 Ed. 2.0 b:2011

Photovoltaic devices - Part 5: Determination of the equivalent cell temperature (ECT) of photovoltaic (PV) devices by the open-circuit voltage method

$25.00 $51.00

IEC 62495 Ed. 1.0 en:2011

Nuclear instrumentation - Portable X-ray fluorescence analysis equipment utilizing a miniature X-ray tube

$72.00 $145.00

IEC 60512-6-2 Ed. 1.0 b:2002

Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump

$12.00 $25.00

IEC 62040-2 Ed. 1.0 b:1999

Uninterruptible power systems (UPS) - Part 2: Electromagnetic compatibility (EMC) requirements

$53.00 $106.00