IEC 60191-6-18 Ed. 1.0 b COR. 1:2010

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

International Electrotechnical Commission, 05/31/2010

Publisher: IEC

File Format: PDF

$148.00$296.67

Published:31/05/2010

Pages:1

File Size:1 file , 82 KB

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