• Your shopping cart is empty!

  • IEC 60191-6-18 Ed. 1.0 b COR. 1:2010

IEC 60191-6-18 Ed. 1.0 b COR. 1:2010

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

International Electrotechnical Commission, 05/31/2010

Publisher: IEC

File Format: PDF

$148.00$296.67


Published:31/05/2010

Pages:1

File Size:1 file , 82 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

More IEC standard pdf

IEC 60661 Ed. 2.1 b:2003

IEC 60661 Ed. 2.1 b:2003

Methods for measuring the performance of electric household coffee makers CONSOLIDATED EDITION

$22.00 $44.00

IEC 61249-2-8 Ed. 1.0 b:2003

IEC 61249-2-8 Ed. 1.0 b:2003

Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

$95.00 $190.00

IEC 61249-2-10 Ed. 1.0 b:2003

IEC 61249-2-10 Ed. 1.0 b:2003

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

$95.00 $190.00

IEC 61249-2-9 Ed. 1.0 b:2003

IEC 61249-2-9 Ed. 1.0 b:2003

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

$95.00 $190.00