• IEC 60191-6-18 Ed. 1.0 b COR. 2:2010

IEC 60191-6-18 Ed. 1.0 b COR. 2:2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

International Electrotechnical Commission, 07/28/2010

Publisher: IEC

File Format: PDF

$119.00$238.41


Published:28/07/2010

Pages:1

File Size:1 file , 81 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

More IEC standard pdf

IEC 60669-1 Ed. 3.1 b:2000

IEC 60669-1 Ed. 3.1 b:2000

Switches for household and similar fixed-electrical installations - Part 1: General requirements CONSOLIDATED EDITION

$105.00 $210.00

IEC 61290-5-1 Ed. 1.0 b:2000

IEC 61290-5-1 Ed. 1.0 b:2000

Optical fibre amplifiers - Basic specification - Part 5-1: Test methods for reflectance parameters - Optical spectrum analyser

$20.00 $41.00

IEC 60068-2-69 Ed. 1.0 b:1995

IEC 60068-2-69 Ed. 1.0 b:1995

Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

$41.00 $82.00

IEC 60626-1 Ed. 2.0 b:1995

IEC 60626-1 Ed. 2.0 b:1995

Combined flexible materials for electrical insulation - Part 1: Definitions and general requirements

$13.00 $26.00