• Your shopping cart is empty!

  • IEC 60191-6-18 Ed. 1.0 b:2010

IEC 60191-6-18 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

International Electrotechnical Commission, 01/07/2010

Publisher: IEC

File Format: PDF

$72.00$145.00


Published:07/01/2010

Pages:40

File Size:1 file , 1.1 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

More IEC standard pdf

IEC 61914 Ed. 1.0 b:2009

IEC 61914 Ed. 1.0 b:2009

Cable cleats for electrical installations

$103.00 $206.00

IEC 60679-1 Ed. 3.0 b:2007

IEC 60679-1 Ed. 3.0 b:2007

Quartz crystal controlled oscillators of assessed quality - Part 1: Generic specification

$176.00 $352.00

IEC 60335-2-79 Amd.2 Ed. 2.0 en:2007

IEC 60335-2-79 Amd.2 Ed. 2.0 en:2007

Amendment 2 - Household and similar electrical appliances - Safety - Part 2-79: Particular requirements for high pressure cleaners and steam cleaners

$46.00 $92.00

IEC 60404-8-6 Amd.1 Ed. 2.0 b:2007

IEC 60404-8-6 Amd.1 Ed. 2.0 b:2007

Amendment 1 - Magnetic materials - Part 8-6: Specifications for individual materials - Soft magnetic metallic materials

$18.00 $36.00