IEC 60191-6-19 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

International Electrotechnical Commission, 02/25/2010

Publisher: IEC

File Format: PDF

$47.00$95.00

Description

Published:25/02/2010

Pages:25

File Size:1 file , 1.5 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

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