• Your shopping cart is empty!

  • IEC 60191-6-2 Ed. 1.0 b:2001

IEC 60191-6-2 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

International Electrotechnical Commission, 12/11/2001

Publisher: IEC

File Format: PDF

$25.00$51.00


Published:11/12/2001

Pages:21

File Size:1 file , 250 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

More IEC standard pdf

IEC 60079-11 Ed. 5.0 b:2006

IEC 60079-11 Ed. 5.0 b:2006

Explosive atmospheres - Part 11: Equipment protection by intrinsic safety "i"

$136.00 $273.00

IEC 62255-1 Ed. 1.0 b:2006

IEC 62255-1 Ed. 1.0 b:2006

Multicore and symmetrical pair/quad cables for broadband digital communications (high bit rate digital access telecommunication networks) - Outside plant cables - Part 1: Generic specification

$38.00 $77.00

IEC 62076 Ed. 1.0 b:2006

IEC 62076 Ed. 1.0 b:2006

Industrial electroheating installations - Test methods for induction channel and induction crucible furnaces

$72.00 $145.00

IEC 61189-6 Ed. 1.0 b:2006

IEC 61189-6 Ed. 1.0 b:2006

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

$164.00 $329.00