• Your shopping cart is empty!

PDF Preview

IEC 60191-6-2 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

International Electrotechnical Commission, 12/11/2001

Publisher: IEC

File Format: PDF

$31.00$62.00


Published:11/12/2001

Pages:10

File Size:1 file , 260 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.

More IEC standard pdf

IEC 61496-3 Ed. 1.0 b:2001

IEC 61496-3 Ed. 1.0 b:2001

Safety of machinery - Electro-sensitive protective equipment - Part 3: Particular requirements for Active Opto-electronic Protective Devices responsive to Diffuse Reflection (AOPDDR)

$95.00 $190.00

IEC 60728-12 Ed. 1.0 en:2001

IEC 60728-12 Ed. 1.0 en:2001

Cabled distribution systems for television and sound signals - Part 12: Electromagnetic compatibility of systems

$58.00 $117.00

IEC 60364-7-717 Ed. 1.0 b:2001

IEC 60364-7-717 Ed. 1.0 b:2001

Electrical installations of buildings - Part 7-717: Requirements for special installations or locations - Mobile or transportable units

$43.00 $87.00

IEC 60243-2 Ed. 2.0 b:2001

IEC 60243-2 Ed. 2.0 b:2001

Electric strength of insulating materials - Test methods - Part 2: Additional requirements for tests using direct voltage

$14.00 $28.00