IEC 60191-6-2 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

International Electrotechnical Commission, 12/11/2001

Publisher: IEC

File Format: PDF

$31.00$62.00

Published:11/12/2001

Pages:10

File Size:1 file , 260 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.

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