• Your shopping cart is empty!

  • IEC 60191-6-22 Ed. 1.0 b:2012

IEC 60191-6-22 Ed. 1.0 b:2012

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FL

International Electrotechnical Commission, 12/11/2012

Publisher: IEC

File Format: PDF

$72.00$145.00


Published:11/12/2012

Pages:34

File Size:1 file , 380 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

More IEC standard pdf

IEC 60793-2-40 Ed. 2.0 b:2006

IEC 60793-2-40 Ed. 2.0 b:2006

Optical fibres - Part 2-40: Product specifications - Sectional specification for category A4 multimode fibres

$71.00 $143.00

IEC 60745-2-13 Ed. 2.0 b:2006

IEC 60745-2-13 Ed. 2.0 b:2006

Hand-held motor-operated electric tools - Safety - Part 2-13: Particular requirements for chain saws

$139.00 $278.00

IEC 60793-1-34 Ed. 2.0 b:2006

IEC 60793-1-34 Ed. 2.0 b:2006

Optical fibres - Part 1-34: Measurement methods and test procedures - Fibre curl

$66.00 $133.00

IEC 60556 Ed. 2.0 en:2006

IEC 60556 Ed. 2.0 en:2006

Gyromagnetic materials intended for application at microwave frequencies - Measuring methods for properties

$115.00 $231.00