IEC 60191-6-22 Ed. 1.0 b:2012

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FL

International Electrotechnical Commission, 12/11/2012

Publisher: IEC

File Format: PDF

$72.00$145.00

Description

Published:11/12/2012

Pages:34

File Size:1 file , 380 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

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