IEC 60191-6-3 Ed. 1.0 b:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

International Electrotechnical Commission, 09/29/2000

Publisher: IEC

File Format: PDF

$72.00$145.00

Published:29/09/2000

Pages:34

File Size:1 file , 320 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.

Radio frequency connectors - Part 1: Generic specification - General requirements and measuring methods

$151.00 $303.00

Amendment 1 - Hand-held motor-operated electric tools - Safety - Part 2-9: Particular requirements for tappers

$6.00 $13.00

Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods - Mechanical

$47.00 $95.00

Optical fibres - Part 2-60: Product specifications - Sectional specification for category C single-mode intraconnection fibres

$70.00 $141.00