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IEC 60191-6-5 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

International Electrotechnical Commission, 08/27/2001

Publisher: IEC

File Format: PDF

$25.00$51.00


Published:27/08/2001

Pages:10

File Size:1 file , 330 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

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