IEC 60191-6-8 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

International Electrotechnical Commission, 08/27/2001

Publisher: IEC

File Format: PDF

$31.00$62.00

Description

Published:27/08/2001

Pages:10

File Size:1 file , 260 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides the common outline drawings and dimensions for all types of structures and composed material of glass sealed ceramic quad flatpack.

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