Your shopping cart is empty!
PDF Preview
International Electrotechnical Commission, 11/01/2022
Publisher: IEC
File Format: PDF
$183.00$367.00
Published:01/11/2022
Pages:84
File Size:1 file , 4.4 MB
Note:This product is unavailable in Ukraine, Russia, Belarus
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.
This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
Industrial systems, installations and equipment and industrial products - Identification of terminals within a system CONSOLIDATED EDITION
$79.00 $158.00
Resin based reactive compounds used for electrical insulation - Part 3: Specifications for individual materials - Sheet 8: Resins for cable accessories
$72.00 $145.00
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 8: Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics
$139.00 $278.00
Static var compensators (SVC) - Testing of thyristor valves
$164.00 $329.00
