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IEC 60286-3 Ed. 7.0 b:2022

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

International Electrotechnical Commission, 11/01/2022

Publisher: IEC

File Format: PDF

$183.00$367.00


Published:01/11/2022

Pages:84

File Size:1 file , 4.4 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.

This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

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