IEC 60352-5 Ed. 3.0 b:2008

Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance

International Electrotechnical Commission, 01/10/2008

Publisher: IEC

File Format: PDF

$94.00$189.00


Published:10/01/2008

Pages:72

File Size:1 file , 1.1 MB

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Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.

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