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International Electrotechnical Commission, 11/13/2014
Publisher: IEC
File Format: PDF
$6.00$13.00
Published:13/11/2014
Pages:8
File Size:1 file , 160 KB
Note:This product is unavailable in Ukraine, Russia, Belarus
Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence
$95.00 $190.00
Specifications for particular types of winding wires - Part 0-8: General requirements - Polyester glass fibre wound, resin or varnish impregnated or not impregnated, bare or enamelled rectangular copper wire
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Good refurbishment practices for medical imaging equipment
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Extra heavy-duty electrical rigid steel conduits
