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International Electrotechnical Commission, 01/27/2011
Publisher: IEC
File Format: PDF
$110.00$221.00
Published:27/01/2011
Pages:57
File Size:1 file , 650 KB
Note:This product is unavailable in Ukraine, Russia, Belarus
Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
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