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International Electrotechnical Commission, 03/25/2002
Publisher: IEC
File Format: PDF
$18.00$36.00
Published:25/03/2002
Pages:15
File Size:1 file , 350 KB
Note:This product is unavailable in Ukraine, Russia, Belarus
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
$25.00 $51.00
Amendment 1 - Specifications for particular types of winding wires - Part 38: Polyester or polyesterimide overcoated with polyamide-imide, enamelled round copper wire, class 200, with a bonding layer
$6.00 $13.00
Optical fibres - Part 1-47: Measurement methods and test procedures - Macrobending loss
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Amendment 1 - Specifications for particular types of winding wires. Part 30: Polyimide enamelled rectangular copper wire, class 220
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