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International Electrotechnical Commission, 08/13/2003
Publisher: IEC
File Format: PDF
$139.00$278.50
Published:13/08/2003
Pages:1
File Size:1 file , 57 KB
Note:This product is unavailable in Ukraine, Russia, Belarus
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
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Non-cellulosic papers for electrical purposes - Part 1: Definitions and general requirements
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Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors
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Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
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