IEC 60749-16 Ed. 1.0 b:2003

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

International Electrotechnical Commission, 01/17/2003

Publisher: IEC

File Format: PDF

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Description

Published:17/01/2003

Pages:13

File Size:1 file , 200 KB

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Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

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