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  • IEC 60749-19 Amd.1 Ed. 1.0 b:2010

IEC 60749-19 Amd.1 Ed. 1.0 b:2010

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

International Electrotechnical Commission, 07/28/2010

Publisher: IEC

File Format: PDF

$6.00$13.00


Published:28/07/2010

Pages:4

File Size:1 file , 280 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

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